Sputtering device

This sputtering device is provided with a cathode unit that discharges sputtering particles toward a substrate on which a film is to be formed, said substrate having a substrate surface. The cathode unit has a target, a magnet unit, a magnet unit scanning unit, and a magnetic line tilting mechanism. The magnet unit has a magnet. The magnetic force line tilting mechanism tilts the magnetic force line formed by the magnet at one swing end toward the other swing end. 本发明的溅射装置具备朝向具有基板表面的被成膜基板排出溅射粒子的阴极单元。阴极单元具有靶、磁铁单元、磁铁单元扫描部和磁力线倾斜机构。磁铁单元具有磁铁。磁力线倾斜机构使在一个摆动端由磁铁形成的磁力线朝向另一个摆动端倾斜。