Electronic device
This electronic device is provided with: a communication module having a communication function and having a first module surface and a second module surface facing the first module surface; the first heat dissipation piece is arranged on the first module surface; the input interface is operated by...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This electronic device is provided with: a communication module having a communication function and having a first module surface and a second module surface facing the first module surface; the first heat dissipation piece is arranged on the first module surface; the input interface is operated by a user; and a frame housing the communication module and having a first surface facing the first module surface and a second surface provided with the input interface and facing the first surface. The first surface of the frame body is provided with a first concave part which is concave towards the second surface; the first concave part is provided with a first wall part which is in contact with the first heat dissipation piece;
本公开的电子设备具备:通信模块,其具备通信功能,并具有第一模块面、以及与第一模块面对置的第二模块面;第一散热件,其配置于第一模块面;供用户操作的输入接口;以及框体,其收容通信模块,并具有与第一模块面面对的第一面、以及设置输入接口且与第一面对置的第二面。框体的第一面具有朝向第二面凹陷的第一凹部,第一凹部具有与第一散热件接触的第一壁部。 |
---|