Metal foil with resin, printed wiring board, method for manufacturing printed wiring board, and semiconductor package

The present invention relates to a metal foil with resin, a printed wiring board using the metal foil with resin, a method for manufacturing the printed wiring board, and a semiconductor package, the metal foil with resin having, in this order, a first thermosetting resin layer containing an inorgan...

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Bibliographische Detailangaben
Hauptverfasser:	SASAKI KAORI, HIROSE GO, HIDAKA KEISUKE, SOMEKAWA JUNKI, NAKAMURA YUKIO, TABATA SHIORI, SHINOZAKI HARUYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention relates to a metal foil with resin, a printed wiring board using the metal foil with resin, a method for manufacturing the printed wiring board, and a semiconductor package, the metal foil with resin having, in this order, a first thermosetting resin layer containing an inorganic filler, a second thermosetting resin layer containing a rubber component, and a metal foil, the content of the inorganic filler in the first thermosetting resin layer is 50-90% by mass, and the content of the inorganic filler in the second thermosetting resin layer is 0-20% by mass. 本发明涉及带树脂的金属箔、使用了该带树脂的金属箔的印刷布线板及其制造方法、以及半导体封装体，所述带树脂的金属箔依次具有：含有无机填充材料的第1热固性树脂层、含有橡胶成分的第2热固性树脂层、以及金属箔，所述第1热固性树脂层中的无机填充材料的含量为50～90质量％，所述第2热固性树脂层中的无机填充材料的含量为0～20质量％。