Circuit board manufacturing method and circuit board

The invention relates to the technical field of circuit board processing, in particular to a circuit board manufacturing method and a circuit board. The invention provides a manufacturing method of a circuit board, and the method comprises the steps: preparing alignment holes in a circuit layer regi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANG LONGZHOU, GE HONGGUANG, HAN XUECHUAN, WU KEJIAN, CHEN WENZHUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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