Circuit board manufacturing method and circuit board

The invention relates to the technical field of circuit board processing, in particular to a circuit board manufacturing method and a circuit board. The invention provides a manufacturing method of a circuit board, and the method comprises the steps: preparing alignment holes in a circuit layer region in a core board, carrying out the alignment processing of a plurality of core boards through the alignment holes in the circuit layer region in the core board and the alignment holes in a non-circuit region of the core board, and carrying out the lamination processing of the core boards after the alignment processing, according to the manufacturing method of the circuit board, irregular expansion and contraction caused by uneven distribution of the residual copper rate of the core board are limited, the alignment precision of the product is improved, and then the yield of the product is improved. 本发明涉及线路板加工技术领域，特别涉及一种线路板的制作方法及线路板。本发明提供一种线路板的制作方法，该制作方法在芯板内部的线路层区域也制备对位孔，利用芯板内部线路层区域的对位孔和芯板非线路区域上的对位孔对多个芯板进行对位处理，对位处理