MEMS pressure transducer chip with hybrid integrated environmental barrier structure and method of manufacturing same

The present disclosure relates to a method for manufacturing a MEMS pressure transducer chip (100) having a hybrid integrated environmental barrier structure (150), the method comprising the steps of: providing a substrate (110) comprising at least one membrane (120); forming a step-like recessed st...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WIESBAUER ANDREAS, MEIER DOMINIK, VASISTO HANNU SAKARI, ANZINGER STEFFEN, FULDNER, MARTIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PUBLIC ADDRESS SYSTEMS TRANSPORTING
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