Wafer processing monitoring level method and system, equipment and medium
The invention discloses a wafer processing monitoring level method and system, equipment and a medium, and relates to a remote monitoring method, which comprises the following steps of: chaining each node; when other nodes exceeding a first threshold decrypt the first data into the remote service da...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a wafer processing monitoring level method and system, equipment and a medium, and relates to a remote monitoring method, which comprises the following steps of: chaining each node; when other nodes exceeding a first threshold decrypt the first data into the remote service data through the Hash algorithm, and when the remote service provider node sends the remote service data for a first duration and a first sending quantity, the remote service data of the next data list is broadcasted; and judging whether the remote service provider node is qualified or not according to a first percentage of a second duration in the first duration and a second percentage of a second sending number in the first sending number. According to the method, each node is linked, so that all the nodes reach a consensus mechanism with the same database, and the sent remote service data can be shared and the quality of the received data can be monitored.
本发明一种晶圆加工监控水平的方法及系统、设备、介质,其涉及一种远程监控方法,其包括如下步骤:将每个节点上链;当超过第 |
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