Wafer processing monitoring level method and system, equipment and medium

The invention discloses a wafer processing monitoring level method and system, equipment and a medium, and relates to a remote monitoring method, which comprises the following steps of: chaining each node; when other nodes exceeding a first threshold decrypt the first data into the remote service da...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHANG WENBIN, LI ZHANWEI, XIE GUIJIU, YI ZHONGBO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a wafer processing monitoring level method and system, equipment and a medium, and relates to a remote monitoring method, which comprises the following steps of: chaining each node; when other nodes exceeding a first threshold decrypt the first data into the remote service data through the Hash algorithm, and when the remote service provider node sends the remote service data for a first duration and a first sending quantity, the remote service data of the next data list is broadcasted; and judging whether the remote service provider node is qualified or not according to a first percentage of a second duration in the first duration and a second percentage of a second sending number in the first sending number. According to the method, each node is linked, so that all the nodes reach a consensus mechanism with the same database, and the sent remote service data can be shared and the quality of the received data can be monitored. 本发明一种晶圆加工监控水平的方法及系统、设备、介质,其涉及一种远程监控方法,其包括如下步骤:将每个节点上链;当超过第