LED packaging structure and packaging method

The invention provides an LED packaging structure and a packaging method. The LED packaging structure comprises a first insulating layer; the LED particles are arranged in the first insulating layer; and the touch sensing part is arranged in the first insulating layer and is used for providing a tou...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUO JIAREN, LI JIKAO, ZHU ZELI, SONG XIAOLAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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