LED packaging structure and packaging method
The invention provides an LED packaging structure and a packaging method. The LED packaging structure comprises a first insulating layer; the LED particles are arranged in the first insulating layer; and the touch sensing part is arranged in the first insulating layer and is used for providing a tou...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an LED packaging structure and a packaging method. The LED packaging structure comprises a first insulating layer; the LED particles are arranged in the first insulating layer; and the touch sensing part is arranged in the first insulating layer and is used for providing a touch sensing function. According to the LED packaging structure, the touch sensing part is packaged in the insulating layer for packaging the LED particles, so that the LED packaging structure not only has a display function, but also has a touch sensing function, the touch sensing function can be realized without adopting an externally-hung touch panel, the thickness of the whole display product can be reduced, and the display product can be lightened and thinned.
本申请提供了一种LED封装结构及封装方法,LED封装结构包括第一绝缘层;LED颗粒,LED颗粒设置于第一绝缘层内;触控传感件,触控传感件设置于第一绝缘层内,用于提供触控感应功能。本申请在封装LED颗粒的绝缘层中封装触控传感件,使得LED封装结构不仅具备显示功能,同时具备触控感应功能,无需采用外挂式触控面板即可实现了触控感应功能,可降低了整体显示产品的厚度,有助于显示产品的轻薄化。 |
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