Packaging method and packaging structure of integrated chip

The invention discloses a packaging method and a packaging structure of an integrated chip, and relates to the technical field of packaging, and the packaging method comprises the following steps: a dielectric layer is formed on the front surface of a device wafer, a first chip is formed in the devi...

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Bibliographische Detailangaben
Hauptverfasser:	LIN WEIMING, LI XIAOXIA, XIE SHAOJIA, HUO CAINENG, QIN KUAI, YUAN CHUANQUAN, ZHANG PUXIANG, GONG HUASHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES SEMICONDUCTOR DEVICES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS
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