Semiconductor packaging structure

A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die, a molding material, an interposer, and a thermal via. The substrate has a wiring structure. A semiconductor die is disposed over the substrate and electrically coupled to the wiring structure. A molding material surrounds the semiconductor die. The interposer is disposed over the semiconductor die. A thermal via is disposed in the interposer and extends to a bottom surface of the interposer. The thermal vias vertically overlap the semiconductor die. 提供了半导体封装结构。半导体封装结构包括衬底、半导体管芯、模制材料、中介件和热通孔。衬底具有布线结构。半导体管芯设置在衬底上方并电耦合到布线结构。模制材料围绕半导体管芯。中介件设置在半导体管芯上方。热通孔设置在中介件中并延伸到中介件的底表面。热通孔与半导体管芯竖直地交叠。