Packaging structure and forming method of packaging structure

The invention discloses a packaging structure and a forming method thereof, and the structure comprises a first wafer which comprises a first device and a first electrical interconnection structure, and the first electrical interconnection structure is electrically connected with the first device; the first connecting layer is located on the first wafer, and one end of the first connecting layer is electrically connected with the first electric interconnection structure; the protection layer is located on the first wafer, the protection layer covers the first device, the first connecting layer is located in the protection layer, and the protection layer exposes the surface of the other end of the first connecting layer; and a first bump on the protective layer, wherein the first bump is electrically connected with the other end of the first connecting layer. The reliability of the packaging structure is improved. 一种封装结构及封装结构的形成方法，结构包括：第一晶片，所述第一晶片包括：第一器件以及第一电互连结构，所述第一电互连结构与所述第一器件电连接；位于所述第一晶片上的第一连接层，所述第一连接层的一端电