Radio frequency module and packaging method thereof

The invention discloses a radio frequency module and a packaging method thereof, and relates to the technical field of semiconductor packaging, the radio frequency module packaging method comprises the steps that a substrate is provided, an underfill device is arranged on the surface of one side of the substrate in a connected mode, and the underfill device is connected with the substrate through a connecting column of the underfill device; a plastic package material packages the surface of one side of the substrate through a mold to form a package, the package wraps the underfill device, fills a gap between the underfill device and the substrate and forms a groove, and a part of the surface of the substrate is exposed through the groove; the exposed surface of the substrate is connected with a non-underfill device through a connecting column of the non-underfill device; and connecting and arranging a covering layer on the surface of the packaging piece, wherein the covering layer blocks the opening of the gr