Method and device for determining minimum wall thickness of pipeline and electronic equipment

The invention provides a method and device for determining the minimum wall thickness of a pipeline and electronic equipment, and belongs to the technical field of data processing. The method comprises the following steps: receiving a pipeline working pressure, a pipeline working temperature, a pipe...

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Bibliographische Detailangaben
Hauptverfasser: WEI RAN, CHANG WEI, YU JIAYU, WANG DONG, REN BINGBING, XU XIAN, LI YAN, CHANG QINGDONG, WANG BIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a method and device for determining the minimum wall thickness of a pipeline and electronic equipment, and belongs to the technical field of data processing. The method comprises the following steps: receiving a pipeline working pressure, a pipeline working temperature, a pipeline material, a steel pipe type, a pipeline outer diameter, an additional thickness and a pipeline type of a to-be-detected pipeline obtained by a terminal through a control; based on the pipeline working temperature and the pipeline material, determining the pipeline allowable stress and the pipeline correction coefficient of the to-be-measured pipeline; determining a stress correction coefficient and a creep coefficient of the to-be-measured pipeline based on the pipeline working temperature and the steel pipe type; and based on the pipeline working pressure, the pipeline allowable stress, the pipeline correction coefficient, the stress correction coefficient, the creep coefficient, the pipeline outer diameter,