Detection method, device and equipment for common GND backflow via hole at PCB wiring layer changing position and medium

The invention relates to the technical field of PCB manufacturing, and provides a method, a device, equipment and a medium for detecting a common GND backflow via hole at a PCB wiring layer changing position, and the method comprises the steps: determining a detection region based on a middle position point of a connection line between a to-be-detected via hole on a target differential wiring and an associated via hole; the associated via holes are via holes in the differential wires around the target differential wire; and determining that only one GND via hole exists in the via holes in the detection area, and determining that a common GND backflow via hole exists in the layer changing position of the target differential wire. According to the method, the detection area is constructed between the to-be-detected via holes in the differential lines and the associated via holes in the peripheral differential lines, and the detection result that the target differential lines share the GND backflow via holes at