Conductive film, connection structure, and method for producing same

Provided is a conductive film (100) capable of improving the connection reliability of a connection structure by suppressing the occurrence of a short circuit by suppressing the movement of conductive particles accompanying the flow of a resin during a conductive connection or an anisotropic conductive connection, the conductive film (100) having an insulating resin layer in which a first resin layer (10), a second resin layer (20), and a third resin layer (30) are laminated in this order. The lowest melt viscosity of each layer increases in the order of the second resin layer 20, the first resin layer 10, and the third resin layer 30. A plurality of conductive particles (40) are dispersed in the insulating resin layer and are held by at least the first resin layer (10) and the second resin layer (20). When the thickness of the first resin layer (10) is Tt, the thickness of the second resin layer (20) is Tc, and the average particle diameter of the conductive particles (40) is D, the conductive film (100) sat