Semiconductor wafer, superposition offset processing device and method thereof

The invention discloses a semiconductor wafer, a processing device and a processing method of superposition offset, the processing device of superposition offset comprises a storage unit and a control unit, the processing device of superposition offset is suitable for the semiconductor wafer with a...

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Bibliographische Detailangaben
Hauptverfasser: CAI MENGXIAN, CAI GAOCAI, LYU YUEFENG, LI ZHENGSHUAI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a semiconductor wafer, a processing device and a processing method of superposition offset, the processing device of superposition offset comprises a storage unit and a control unit, the processing device of superposition offset is suitable for the semiconductor wafer with a plurality of detection areas, each detection area is provided with a plurality of groups of superposition patterns, each group of superposition patterns comprises an original alignment pattern without a preset offset, and the original alignment pattern is not provided with a preset offset. And a plurality of predetermined offset alignment patterns disposed near the original alignment pattern and having a predetermined offset. The storage unit stores initial post-etching detection superposition data corresponding to the detection area. The control unit compares the post-development detection superposition data of the original alignment pattern and the predetermined offset alignment pattern with stored initial post-e