Semiconductor packaging structure and forming method thereof

Semiconductor package structures and methods of forming the same are provided. The semiconductor package structure includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a passivation layer on the semiconductor substrate and the conductive pad. The passivation layer exposes a portion of the top surface of the conductive pad. The semiconductor package structure further includes a conductive adhesive layer on the conductive pad, and a dielectric layer on the passivation layer and the conductive adhesive layer. The dielectric layer exposes a portion of the conductive adhesive layer. The semiconductor package structure further includes a redistribution layer (RDL) structure on the dielectric layer and electrically connected to the conductive pad through the conductive adhesive layer. The semiconductor package structure also includes a bump structure on the RDL structure. 提供了半导体封装结构及其形成方法。半导体封装结构包括半导体衬底、在半导体衬底上的导电焊盘以及在半导体衬底和导电焊盘上的钝化层。钝化层露出导电焊盘的顶表面的部分。半导体封装结构还包括：在导电焊盘上的导电粘合层，以及在钝化层