Semiconductor device manufacturing apparatus and semiconductor device manufacturing method

The present invention relates to an apparatus for manufacturing a semiconductor device and a method for manufacturing a semiconductor device, which can appropriately pick up each semiconductor chip in a state of being easily peeled off from a dicing sheet even when semiconductor chips of different sizes exist in a mixed manner. A pickup device (10) is provided with: a stage (12) having a plurality of protrusions (13) disposed so as to face the back surface of a dicing sheet (100) to which a semiconductor chip (101) is attached; and a suction unit (14) that vacuumizes the space among the outer frame (11), the dicing blade (100), and the table (12). The plurality of protrusions (13) include a plurality of first protrusions (13a) and a plurality of second protrusions (13b) having different heights or elastic moduli in the vertical direction. 本发明涉及半导体装置的制造装置以及半导体装置的制造方法，即使在尺寸不同的半导体芯片混合存在的情况下，也能够将各个半导体芯片适当地设为容易从切割片剥离的状态而进行拾起。拾取装置(10)具有：工作台(12)，其具有与贴附有半导体芯片(101)的切割片(100)的背面相对地配置的多个凸起部(13)；以及吸引单元(14)，其将外框(11)、切割片(10