Substrate laser hole processing method and packaging substrate

The invention discloses a substrate laser hole machining method which comprises the following steps that laser hole position parameters are obtained, and the position comprises a non-large etching area and a large etching area; the laser hole diameter is obtained, the laser hole in the non-large etching area is provided with a first hole diameter, and the laser hole in the large etching area is provided with a second hole diameter; laser drilling parameters are obtained, a first laser parameter is configured for the first aperture, and a second laser parameter is configured for the second aperture; and a laser hole is machined according to the laser drilling parameters. The laser holes in different areas are subjected to differential compensation, differential production conditions are set, the laser holes can meet the precision requirement of the FCBGA packaging substrate laser holes, and the production yield is improved. 本发明公开了一种基板激光孔加工方法，包括如下步骤：获取激光孔位置参数，所述位置包括非大蚀刻区域和大蚀刻区域；获取激光孔孔径，所述非大蚀刻区域激光孔具有第一孔径，所述大蚀刻区域