Ultra-wideband SIP radio frequency module ball mounting method

The invention is suitable for the technical field of semiconductor packaging. The invention discloses an ultra wide band SIP radio frequency module ball mounting method, which comprises a laser spray welding step of performing spray welding on each welding spot one by one, and the laser spray welding step comprises the steps of firstly pressurizing a welding ball, then heating the pressurized welding ball to a melting point through laser, performing spray welding on the welding ball towards the direction of the welding spot, and forming a welding layer at the position of the welding spot. During use, the solder balls with the same size are adopted each time, the spray welding amount each time is the same, the tin amount consistency of the same solder point can be accurately guaranteed, the morphology consistency and the high coplanarity of solder bumps are further guaranteed, and the machining quality is improved; laser non-contact jet welding is adopted, soldering flux does not need to be used, and the relia