Thermal management system and method for externally mounted electronics of aircraft

The invention provides a thermal management system. The thermal management system includes a housing extending between a front end and a rear end. The housing includes a cooling structure defining at least one inlet, at least one outlet, and a conduit connected in flow communication between the at least one inlet and the at least one outlet. The cooling structure is configured to generate fluid flow from the at least one inlet through the conduit to the at least one outlet in response to movement of the housing through the fluid. The thermal management system also includes an electronic component disposed in contact with the cooling structure. The cooling structure is configured to transfer heat generated by the electronic component to the fluid flowing through the conduit to cool the electronic component. 本发明提供了一种热管理系统。热管理系统包括在前端和后端之间延伸的壳体。该壳体包括冷却结构，该冷却结构限定至少一个入口、至少一个出口和以流动连通的方式连接在该至少一个入口与该至少一个出口之间的管道。冷却结构被配置成响应于壳体穿过流体的移动而产生从至少一个入口穿过管道到至少一个出口的流体流动。热管理系统还包括与冷却结构接触设置的电子组件。冷却结构被配置为将由电子组件产生的热量传递到通过管道流动的流体以冷却电子组件