Packaging structure, packaging substrate and manufacturing method thereof

The invention provides a packaging substrate, which comprises a circuit board, a filling colloid and at least one lead, and the lead comprises a lead body and a lead terminal connected to one end of the lead body. A through groove is formed in the circuit board in a penetrating mode in the thickness direction, and the circuit board comprises an insulator and a first circuit layer arranged on one side of the insulator. The lead body is provided with a through groove, the filling colloid is arranged in the through groove, the lead terminal protrudes out of the surface of the filling colloid, the other end, away from the lead terminal, of the lead body is electrically connected with the circuit board, and the filling colloid wraps the lead body. According to the packaging substrate, the lead terminals are arranged to replace traditional welding pads, the interconnection density can be further improved, cost is low, design is flexible, and flexible connection with external elements can be achieved by controlling