Cutting method for improving hole wall quality of surface-mounted fixed attenuator

The invention discloses a cutting method for improving the hole wall quality of a surface-mounted fixed attenuator, and belongs to the field of chip electronic component manufacturing. The cutting method comprises the following steps: melting the sealing lacquer or paraffin on a hot platform, fixing the surface-mounted fixed attenuator substrate on the ceramic gasket, filling the holes, and striking off the sealing lacquer or paraffin overflowing to the surface of the substrate, so that the filled sealing lacquer or paraffin, the surface-mounted fixed attenuator substrate and the ceramic gasket are integrated to be sliced; the integrated slice to be cut is taken down from the hot platform, and the sealing wax or the paraffin is in a solid state with certain strength after being cooled; the integrated slice to be cut is attached to a UV film; grinding wheel cutting is conducted along the cutting line; after the whole piece is cut, fully dissolving the sealing wax or the paraffin wax by using alcohol; and the s