Manifold micro-channel heat dissipation device, manufacturing method thereof and method for heat dissipation

The invention relates to a manifold micro-channel heat dissipation device, a manufacturing method thereof and a heat dissipation method. The manifold micro-channel heat dissipation device comprises a substrate, a plurality of fins, a heat dissipation structure and a cover plate. The fins and the heat dissipation structure are located between the substrate and the cover plate. The fins are evenly distributed around the central axis perpendicular to the base plate. The heat dissipation structure is provided with an inlet manifold channel, a plurality of flow dividing manifold channels, a plurality of annular micro-channels and a plurality of water outlet manifold channels. The inlet manifold channel directly faces the plurality of fins along the central axis. The multiple flow dividing manifold channels are evenly distributed around the central axis, and each flow dividing manifold channel communicates with the inlet manifold channel. The multiple annular micro-channels are evenly distributed around the central