Preparation method of semiconductor chip with asymmetric geometric structure

The invention relates to the technical field of semiconductor chips, in particular to a preparation method of an asymmetric geometric structure semiconductor chip. According to the method, firstly, chip images at different angles are obtained, and each chip image is equally divided into at least two sub-blocks; combining the chip images corresponding to the same chip at different angles to obtain a target image; obtaining tool path cutting time and an overheating temperature coefficient corresponding to the chip image; and inputting the chip image, the cutter path cutting time and the overheating temperature coefficient into the trained expert model, and judging the chip arrangement quality corresponding to the chip image. According to the preparation method provided by the embodiment of the invention, by analyzing the surface reflection characteristics of the semiconductor chip, the angle, the attitude and the comprehensive arrangement mode are determined, so that the chip arrangement condition is optimized.