Dynamic packaging stress compensation temperature sensor chip and stress compensation method

The embodiment of the invention provides a dynamic packaging stress compensation temperature sensor chip, and the chip comprises a temperature sensor which is configured to convert the external temperature into a first voltage signal and a second voltage signal; the stress sensor is integrated in the temperature sensor and is configured to convert stress into a third voltage signal; the analog-to-digital converter is configured to combine the first voltage signal and the second voltage signal, convert the first voltage signal and the second voltage signal into a digital temperature signal and convert the third voltage signal into a digital stress signal; the digital processing module is configured to carry out digital processing on the digital temperature signal and the digital stress signal respectively and convert the digital temperature signal and the digital stress signal into an actual temperature signal and an actual stress signal respectively; and packaging a stress compensation module, calculating the