Pressure sensing adhesive tape suitable for element cutting process

The invention discloses a pressure sensing adhesive tape which is suitable for a cutting process of an element. The pressure-sensitive adhesive tape comprises a release film layer, an adhesive layer and a supporting base layer which are stacked in sequence. Based on 100 weight percent concentration of the total weight of the adhesive layer, the adhesive layer comprises 40 to 50 weight percent concentration of acryl resin, 40 to 65 weight percent concentration of epoxy monomer, 0.05 to 0.5 weight percent concentration of hardener and 0.5 to 1.0 weight percent concentration of initiator. Wherein the adhesive layer has a first acid value before being exposed by the ultraviolet light, the adhesive layer shrinks after being exposed by the ultraviolet light and has a second acid value, and the second acid value is smaller than the first acid value. Therefore, the bonding strength of the adhesive layer and the cutting base material is improved, and residual adhesive after removal can be avoided. 本发明公开一种感压胶带，其适合用于元件的