Elastic wave device and method for manufacturing elastic wave device

Provided are an elastic wave device in which the shape and depth of a through hole are stabilized, and a method for manufacturing the elastic wave device. An elastic wave device includes: a first substrate; a piezoelectric layer having one main surface and the other main surface facing the thickness...

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Bibliographische Detailangaben
Hauptverfasser: YAMANE TAKASHI, YAMAZAKI HISASHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Provided are an elastic wave device in which the shape and depth of a through hole are stabilized, and a method for manufacturing the elastic wave device. An elastic wave device includes: a first substrate; a piezoelectric layer having one main surface and the other main surface facing the thickness direction of the first substrate, the one main surface facing the first substrate; a functional electrode provided on at least one of one main surface and the other main surface of the piezoelectric layer; a second substrate having a first main surface and a second main surface facing the other main surface of the piezoelectric layer, and a through-hole penetrating from the first main surface to the second main surface, the first main surface facing the other main surface of the piezoelectric layer; a via electrode disposed in the through hole; a wiring layer disposed between the piezoelectric layer and the second substrate and electrically connecting the functional electrode and the via electrode; and an etch sto