Resin and preparation method thereof

The present application relates to a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition. 本申请涉及包含化学式1的单元的树脂、用于制备其的方法、包含其的树脂组合物以及包含树脂组合物的模制品。...

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Bibliographische Detailangaben
Hauptverfasser: CHOI IL-HWAN, KIM KYUNG-MOON, BAE JAESOON, BAEK HYUN-WOO, LIM HYE-JIN, BAEK JONG-HWA, LEE SEUNGMOOK, RYU SEUNG-MIN, SHIN HYEONAH
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present application relates to a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition. 本申请涉及包含化学式1的单元的树脂、用于制备其的方法、包含其的树脂组合物以及包含树脂组合物的模制品。