In-situ monitoring device and method for welding spot defects in two-dimensional packaging process of flip chip

The invention relates to the technical field of detection of welding spot reliability in the bonding process of an advanced packaging flip chip, in particular to an in-situ monitoring device and method for welding spot defects in the two-dimensional packaging process of a flip chip. The method comprises the following steps of: 1, placing two-dimensional flip chips which are aligned and stacked on a support material; step 2, adjusting the two-dimensional flip chips and the thermal infrared imager, so that the two-dimensional flip chips which are aligned and stacked can be clearly imaged in the thermal infrared imager, and the two-dimensional flip chips are located right below the heating mechanism; and step 3, controlling the bonding head of the heating mechanism to move downwards through the movement transmission mechanism, stopping moving when the bonding head of the heating mechanism is in contact with the flip chip, setting a bonding heating curve of the heating mechanism, controlling the bonding head of t