MULTILAYER ELECTRONIC COMPONENT

The present disclosure provides a multilayer electronic component including: a body including a dielectric layer and an internal electrode; and an outer electrode disposed outside the body and connected to the inner electrode, in which the dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains includes a core-shell structure including a core region and a shell region covering at least a portion of the core region, and 90% or more of the plurality of dielectric grains satisfy an average size of 170.0 nm to 190.0 nm, and a maximum deviation of a size of the dielectric grains from the average size of the plurality of dielectric grains satisfies +/-60.0 nm. 本公开提供一种多层电子组件，所述多层电子组件包括：主体，包括介电层和内电极；以及外电极，设置在所述主体外部，并且连接到所述内电极，其中，所述介电层包括多个介电晶粒，并且所述多个介电晶粒中的至少一个介电晶粒包括核-壳结构，所述核-壳结构包括核区域和覆盖所述核区域的至少一部分的壳区域，并且所述多个介电晶粒中的90％或更多的介电晶粒满足170.0nm至190.0nm的平均尺寸，并且相对于所述多个介电晶粒的平均尺寸，所述介电晶粒的尺寸的最大偏差满足±60.0nm。