Method and system for manufacturing MEMS device caps

A device includes a substrate including a first mount, a second mount, a third mount, a first cavity, a second cavity, and a bonding material covering portions of the first mount, the second mount, and the third mount. A first cavity is positioned between the first mount and the second mount, and a second cavity is positioned between the second mount and the third mount. The first cavity includes a first cavity region and a second cavity region separated by a portion of the substrate protruding to the first cavity, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. The surface of the first cavity is covered with a getter material. 一种器件，包括：衬底，该衬底包括第一支座、第二支座、第三支座、第一腔体、第二腔体、以及接合材料，该接合材料覆盖第一支座、第二支座和第三支座的部分。第一腔体被定位在第一支座与第二支座之间，并且第二腔体被定位在第二支座与第三支座之间。第一腔体包括由衬底的突出到第一腔体的部分分开的第一腔体区域和第二腔体区域，并且其中与第一腔体区域相关联的深度大于与第二腔体相关联的深度。第一腔体的表面覆盖有吸气剂材料。