Wafer, manufacturing method thereof, packaging structure and packaging method

The invention discloses a wafer and a manufacturing method thereof, a packaging structure and a packaging method, and the packaging method comprises the steps: providing a plurality of wafers, including a first wafer and a second wafer, provided by the embodiment of the invention; oppositely bonding...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUI KAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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