Wafer, manufacturing method thereof, packaging structure and packaging method

The invention discloses a wafer and a manufacturing method thereof, a packaging structure and a packaging method, and the packaging method comprises the steps: providing a plurality of wafers, including a first wafer and a second wafer, provided by the embodiment of the invention; oppositely bonding the bonding surfaces of the first wafer and the second wafer; and laser irradiation processing is performed on the second dielectric layer along the edge of the wafer, so that laser is totally reflected at the interface of the second dielectric layer and the reflective layer, and the laser is propagated in the second dielectric layer between the reflective layers of the wafer and is transmitted to the inside of the wafer from the edge of the wafer. The bonding interface between the corresponding wafers can absorb the energy of laser, especially the bonding interface between the bonding pad and the second dielectric layer absorbs the energy of the laser, so that the activity of molecules on the interface between th