Diode layer stack flip chip mounted to lead frame by using copper nickel tin metallization stack and diffusion soldering

Disclosed is a diode layer stack flip chip mounted to a lead frame by using a copper nickel tin metallization stack and diffusion soldering. A method (100) for manufacturing a diode layer stack comprises: providing a diode layer stack (110) comprising: a silicon carbide diode die comprising a first...

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Bibliographische Detailangaben

1. Verfasser:	OTREMBA RALF
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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