Joint type production process of surface-mounted ceramic electronic component

The invention discloses a joint belt type production process of a surface-mounted ceramic electronic component, which comprises the following steps of: forming a lead: unwinding a metal material belt, and gradually punching the metal material belt to obtain a first lead belt and a second lead belt which continuously extend; the second lead belt is cut off in sequence to form branch lead belts; assembling the chip: printing or dispensing solder on the end of the lower lead of the first lead belt, then placing the chip on the end of the lower lead, printing or dispensing solder on the upper surface of the chip, then enabling the branch lead belt and the first lead belt to be oppositely arranged, and enabling the end of the upper lead of the branch lead belt to be attached to the upper surface of the chip in a one-to-one correspondence manner; welding: firmly welding the chip with the first lead belt and the branch lead belt; and plastic packaging: packaging an insulating resin material on the outer side of each