Glass core package substrate

Apparatuses, systems, and methods for efficiently producing package substrates. A semiconductor manufacturing process (or process) manufactures each of a first glass package substrate and a second glass package substrate, each having a redistribution layer on a single side of a respective glass wafer. In the process, the second glass package substrate is turned over up and down, and the glass wafer of the first glass package substrate and the glass wafer of the second glass package substrate are connected together by using a wafer bonding technology. In some implementations, the process uses copper-based wafer bonding. The resulting bonding portion between the two glass wafers does not contain an air gap, does not contain an underfill, and does not contain a solder bump. A side of the first glass package substrate opposite the glass wafer is then connected to at least one integrated circuit. In addition, one side, opposite to the glass wafer, of the second glass packaging substrate is connected to a component