Photosensitive resin composition, cured product, printed wiring board, and method for producing printed wiring board

The present invention addresses the problem of providing a photosensitive resin composition with which it is possible to form a resist layer that combines good adhesion and peelability with respect to a substrate before and after curing compared to conventional photosensitive resin compositions, and that suppresses modification due to contact with a plating solution and elution into the plating solution. [Solution] In a photosensitive resin composition, a non-photosensitive alkali-soluble resin as an alkali-soluble resin, an alkylene oxide-modified bifunctional (meth) acrylate as a photosensitive monomer, and an alkylene oxide-modified trifunctional (meth) acrylate are combined. 本发明的课题是提供感光性树脂组合物，其与以往的感光性树脂组合物相比，能够形成兼顾在固化前后相对于基板的良好的密合性和剥离性，并且抑制与镀覆液的接触而引起的改性以及向镀覆液的溶出的抗蚀剂层。本发明的解决手段是在感光性树脂组合物中，将作为碱可溶性树脂的非感光性碱可溶性树脂、作为感光性单体的环氧烷改性的双官能(甲基)丙烯酸酯以及环氧烷改性的三官能(甲基)丙烯酸酯组合来配合。