Electroplating circulation system

Electroplating circulation system

The invention discloses an electroplating circulation system which comprises an electroplating device, a stirring device, a flow control device and a main control device electrically connected with the stirring device and the flow control device, the electroplating device comprises a first electropl...

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Hauptverfasser: HUANG HONGYI, PENG ZHENGUO, XU LAIFENG
Format: Patent
Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator HUANG HONGYI
PENG ZHENGUO
XU LAIFENG
description The invention discloses an electroplating circulation system which comprises an electroplating device, a stirring device, a flow control device and a main control device electrically connected with the stirring device and the flow control device, the electroplating device comprises a first electroplating bath and a second electroplating bath, and the liquid inlet end of the first electroplating bath is communicated with the liquid outlet end of the second electroplating bath; the stirring device is arranged in the first electroplating bath; the flow control device is provided with a first end and a second end which are oppositely arranged, the first end and the second end are connected with the first electroplating bath and the second electroplating bath respectively, and the flow control device is used for communicating the liquid outlet end of the first electroplating bath with the liquid inlet end of the second electroplating bath in a working state. The stirring device is used for stirring the electroplat
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Electroplating circulation system
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