Electroplating circulation system
The invention discloses an electroplating circulation system which comprises an electroplating device, a stirring device, a flow control device and a main control device electrically connected with the stirring device and the flow control device, the electroplating device comprises a first electropl...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses an electroplating circulation system which comprises an electroplating device, a stirring device, a flow control device and a main control device electrically connected with the stirring device and the flow control device, the electroplating device comprises a first electroplating bath and a second electroplating bath, and the liquid inlet end of the first electroplating bath is communicated with the liquid outlet end of the second electroplating bath; the stirring device is arranged in the first electroplating bath; the flow control device is provided with a first end and a second end which are oppositely arranged, the first end and the second end are connected with the first electroplating bath and the second electroplating bath respectively, and the flow control device is used for communicating the liquid outlet end of the first electroplating bath with the liquid inlet end of the second electroplating bath in a working state. The stirring device is used for stirring the electroplat |
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