Substrate processing equipment

A substrate processing apparatus includes: a heat treatment chamber providing a heat treatment space for heat-treating a substrate; a cooling chamber arranged to be spaced apart from the heat treatment chamber in a horizontal direction; and a cover sealing the heat treatment chamber and the cooling chamber, in which the cooling chamber includes: a housing in which a cooling treatment space is defined; a cooling plate on which the substrate is placed; a first loading/unloading port disposed in one inner wall of the housing and defining a path for loading/unloading the substrate from the outside with respect to the cooling chamber; and a first purge gas supply unit disposed in an inner wall of the housing and providing a first purge gas to the cooling processing space. 一种基底加工设备包括：热处理室，提供用于对基底进行热处理的热处理空间；冷却室，布置为在水平方向上与热处理室间隔开；以及盖，密封热处理室和冷却室，其中，冷却室包括：壳体，在所述壳体中限定冷却处理空间；冷却板，在所述冷却板上放置基底；第一载入/载出口，布置在壳体的一个内壁中并且限定供基底相对于冷却室被从外部载入/被载出的路径；以及第一吹扫气体供应单元，布置在壳体的内壁中并且向冷却处理空间提供第一吹扫气体。