Selective insulation of mounting points

An electronic device is provided that includes a heat sink, an electrical circuit mounted on the heat sink, and a chassis. A plurality of thermally insulating connectors mount the heat sink to the chassis at a first plurality of mounting points, and a plurality of thermally conductive connectors mou...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RESNICK STEVEN A, SAUERS, JOHN, C, HOBSON PHILLIP M, CAMPO LAURA M, MOROANU DORIN, SELVANKUMAR, SRIDHAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS
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