Selective insulation of mounting points
An electronic device is provided that includes a heat sink, an electrical circuit mounted on the heat sink, and a chassis. A plurality of thermally insulating connectors mount the heat sink to the chassis at a first plurality of mounting points, and a plurality of thermally conductive connectors mou...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | An electronic device is provided that includes a heat sink, an electrical circuit mounted on the heat sink, and a chassis. A plurality of thermally insulating connectors mount the heat sink to the chassis at a first plurality of mounting points, and a plurality of thermally conductive connectors mount the heat sink to the chassis at a second plurality of mounting points. The first plurality of mounting points are positioned closer to an electrical circuit mounted on the heat sink than the second plurality of mounting points.
提供了一种电子设备,该电子设备包括散热器、安装在散热器上的电气电路和底盘。多个绝热连接器在第一多个安装点处将散热器安装到底盘,并且多个导热连接器在第二多个安装点处将散热器安装到底盘。第一多个安装点比第二多个安装点更靠近安装在散热器上的电气电路定位。 |
---|