Method for improving printing ink hole plugging quality of printed board processed by high-viscosity hole plugging printing ink
The invention belongs to the technical field of printed circuit boards, and particularly relates to a method for improving printing ink hole plugging quality of a printed board processed by high-viscosity hole plugging printing ink. According to the technical scheme, the method for improving the pri...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention belongs to the technical field of printed circuit boards, and particularly relates to a method for improving printing ink hole plugging quality of a printed board processed by high-viscosity hole plugging printing ink. According to the technical scheme, the method for improving the printing ink hole plugging quality of the printed board processed through the high-viscosity hole plugging printing ink comprises the following steps that S1, conductive holes in the printed board are plugged through the high-viscosity hole plugging printing ink; s2, pre-curing the high-viscosity hole plugging ink in the conductive hole; and S3, leveling the high-viscosity hole plugging ink at the hole opening of the pre-cured conductive hole. The invention provides a method for improving printing ink hole plugging quality of a printed board processed by high-viscosity hole plugging printing ink. According to the method, the coverage aperture range of the ink plug hole is wide, the plumpness of the plug hole is high, |
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