Integrated micro coaxial airtight packaging structure and manufacturing method thereof

The invention is applicable to the technical field of microelectronic packaging, and provides an integrated micro-coaxial airtight packaging structure and a manufacturing method thereof, and the packaging structure comprises a substrate, a micro-coaxial structure, a chip, a passive device, a first i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG LEI, MA CHENGLONG, SONG XUEFENG, ZHANG LUYANG, KONG LINGJIA, LI SHIJUN, YUAN BIAO, XU DA, YANG YANFENG, WANG JIAN, WEI SHAOWEI, WU HAOYU, ZUO GUOSEN, WANG ZHEN, SHI GUANGHUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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