Integrated micro coaxial airtight packaging structure and manufacturing method thereof

The invention is applicable to the technical field of microelectronic packaging, and provides an integrated micro-coaxial airtight packaging structure and a manufacturing method thereof, and the packaging structure comprises a substrate, a micro-coaxial structure, a chip, a passive device, a first isolation wall, a second isolation wall and a cover plate. The micro coaxial structure, the first isolation wall and the second isolation wall are grown from the substrate; the first isolation wall grows on the outer side of the upper surface of the substrate, and the micro coaxial structure and the second isolation wall grow on the inner side of the upper surface of the substrate; the chip and the passive device are arranged on the upper surface of the substrate; the second isolation wall is arranged around the open passive device and the chip to isolate electromagnetic interference; the cover plate, the substrate and the first isolation wall form a sealed space, and the micro coaxial structure, the chip, the passi