Apparatus and method for processing substrate

An apparatus and method for processing a substrate can reduce the concentration of processing by-products in a chemical solution. The apparatus includes: a substrate rotating device configured to rotate a disposed substrate in a rotational manner; a chemical solution supply apparatus configured to s...

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Bibliographische Detailangaben
Hauptverfasser: CHUNG DAE-HYUK, HAN JIN-A, KIM HEEHWAN, KIM KYOUNG-SUK, PARK JONG HYUK, HONG YONG-HOON, PARK JIN-HYUNG, CHA, JI HOON, KIM MIN-JUNG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An apparatus and method for processing a substrate can reduce the concentration of processing by-products in a chemical solution. The apparatus includes: a substrate rotating device configured to rotate a disposed substrate in a rotational manner; a chemical solution supply apparatus configured to supply a chemical solution to the substrate; a chemical solution discharge line configured to discharge the chemical solution that has undergone the treatment to the outside; a chemical solution circulation line configured to circulate the chemical solution that has undergone the treatment to the chemical solution supply apparatus; and a discharged chemical solution selection device configured to discharge a chemical solution containing a first amount of treatment by-products to the outside through a chemical solution discharge line, and to circulate a chemical solution containing a second amount of treatment by-products through a chemical solution circulation line, wherein the first number of treatment byproducts i