Sputtering device

This sputtering device is provided with a cathode unit that discharges sputtering particles toward a substrate on which a film is to be formed, said substrate having a substrate surface. The cathode unit has a target, a magnet unit, and a magnet unit scanning section. The density of the magnetic force generated at the end portion near the contour edge of the swing region and the density of the magnetic force generated at the central portion of the swing region are uniformized. 本发明的溅射装置具备朝向具有基板表面的被成膜基板排出溅射粒子的阴极单元。阴极单元具有靶、磁铁单元和磁铁单元扫描部。在位于摆动区域的轮廓边附近的端部产生的磁力密度和在所述摆动区域的中央部产生的磁力密度被均匀化。