Wafer gluing machine for semiconductor processing

The invention relates to gluing equipment in the field of semiconductors, in particular to a wafer gluing machine for semiconductor processing. Comprising a discharging tank I, arc-shaped frames, electric push rods, sliding frames, scrapers, arc-shaped baffles and the like, the discharging tank I is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WANG ZHIHONG, SHEN XING, WU KAITAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to gluing equipment in the field of semiconductors, in particular to a wafer gluing machine for semiconductor processing. Comprising a discharging tank I, arc-shaped frames, electric push rods, sliding frames, scrapers, arc-shaped baffles and the like, the discharging tank I is connected to the top face of a workbench, the arc-shaped frames are symmetrically connected into the discharging tank I, the electric push rods are symmetrically connected to the discharging tank I, the sliding frames are connected to telescopic rods of the electric push rods, and the sliding frames slidably penetrate through the side face of the discharging tank I; the scraping plate is connected to the side face of the arc-shaped frame, and the arc-shaped baffles are evenly connected to the sliding frame at intervals and located in the arc-shaped frame. According to the invention, the arc-shaped baffle plate can block the photoresist solution thrown out from the wafer, so that the thrown-out photoresist solution